Documento técnico
Learn about Henkel's innovation in NCF materials that addresses the demands of 3D through-silicon via (TSV) memory chip processing, system in package (SiP) configurations and other heterogeneous integration design.
This white paper explains the benefits of NCF for advanced packaging processing and introducing the latest NCF material, wafer-applied underfill films, designed to balance flow behavior and cure kinectics, providing good fillet coverage and complete gap filling.
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