Part no. (SKU/IDH):
2575316
IDH Name:
TGF 3010APS-B-60
Thermal gap fillers
High performance dispensable liquid for e-Mobility battery applications
This highly thermally conductive liquid gap filler has easy, fast dispensing and low-stress assembly and is ideal for high-throughput applications like EV battery applications and automotive power storage systems.
Part no. (SKU/IDH):
2575316
IDH Name:
TGF 3010APS-B-60
Packaging type Please make your selection Barrel
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 3010APS is a silicone-free, 2-part gap filler with a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and room temperature cure. It is designed for low-stress silicone-sensitive applications, avoiding damage during battery module assembly. A great product when you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress.
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Very high dispense rate
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Low compression force
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Room temperature cure
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High thermal conductivity: 3 W/mK
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, high volume liquids
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Thermal management, standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Colour:
- White
- Mixed: Colour:
- Black
- Operating temperature:
- -40.0 °C - 80.0 °C
- Resin: Colour:
- Black
- Thermal conductivity:
- 3.0 W/mK
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