Part no. (SKU/IDH):
2189263
IDH Name:
BERGQUIST® SIL PAD® TSP Q2000
Thermal SIL PAD Materials
Electrically conductive fibreglass-reinforced pad – withstands processing stress
This thermally conductive, fibreglass-reinforced silicone insulator pad is suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.
Part no. (SKU/IDH):
2189263
IDH Name:
BERGQUIST® SIL PAD® TSP Q2000
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® SIL PAD® TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. It can be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fibreglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
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Thermal impedance: 0.35°C-in2/W (@50 psi)
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Eliminates processing constraints typically associated with grease
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Easy handling
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Conforms to surface textures
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermal management, sil pads
- Carrier type:
- Glass Fibre
- Colour:
- Black
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 180.0 °C
- Thermal conductivity:
- 0.2 W/mK
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