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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Part no. (SKU/IDH):
2189263

IDH Name:
BERGQUIST® SIL PAD® TSP Q2000

Thermal SIL PAD materials

BERGQUIST® SIL PAD® TSP Q2000

Electrically conductive fibreglass-reinforced pad – withstands processing stress

This thermally conductive, fibreglass-reinforced silicone insulator pad is suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.

Part no. (SKU/IDH):
2189263

IDH Name:
BERGQUIST® SIL PAD® TSP Q2000

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® SIL PAD® TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. It can be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fibreglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

  • Product category:
  • Thermal SIL PAD materials

Technologies:

  • Carrier type:
  • Glass Fibre

 

  • Colour:
  • Black

 

  • Flame rating:
  • V-0

 

  • Operating temperature:
  • -60.0 °C - 180.0 °C

 

  • Thermal conductivity:
  • 0.2 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

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