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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Part no. (SKU/IDH):
2167935

IDH Name:
BERGQUIST® GAP PAD® TGP HC3000, 8″x16″ dimension, 0.080″ thickness

Thermal GAP PAD materials

BERGQUIST® GAP PAD® TGP HC3000

Soft, fibreglass-reinforced insulation pad for low-stress applications

This thermally conductive, silicone-based, fibreglass-reinforced filler has a high thermal conductivity rating of 3.0 W/m-K.

Part no. (SKU/IDH):
2167935

IDH Name:
BERGQUIST® GAP PAD® TGP HC3000, 8″x16″ dimension, 0.080″ thickness

Part no. (SKU/IDH) 2167935
BERGQUIST® GAP PAD® TGP HC3000, 8″x16″ dimension, 0.080″ thickness

Thickness Please make your selection 0.080″

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.

  • Product category:
  • Thermal GAP PAD materials

Technologies:

  • Carrier type:
  • Glass Fibre

 

  • Colour:
  • Blue

 

  • Flame rating:
  • V-0

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Standard thickness:
  • 0.508 mm - 3.175 mm

 

  • Thermal conductivity:
  • 3.0 W/mK

 

  • Young's modulus, ASTM D575:
  • 110.0 KPa (16.0 psi)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

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