Thermal GAP PAD Materials
Extremely soft, high-performance electrically insulating pad
This high-performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP PAD® TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures thanks to a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
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Thermal conductivity: 7 W/m-K
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Low compression stress
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High compliance
- Product category:
- Thermal GAP PAD Materials
Technologies:
-
Thermal management, gap pads
- Colour:
- Grey
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Standard thickness:
- 0.5 mm - 3.18 mm
