Part no. (SKU/IDH):
2167481
IDH Name:
BERGQUIST GAP PAD TGP 3500ULM
Thermal GAP PAD materials
Soft, fibreglass-reinforced, electrically insulating pad
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
Part no. (SKU/IDH):
2167481
IDH Name:
BERGQUIST GAP PAD TGP 3500ULM
Thickness Please make your selection 0.080″
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP PAD® TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Thermal conductivity: 3.5 W/m-K
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Fibreglass-reinforced for puncture, shear and tear resistance
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High compliance, low compression stress
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Non-fibreglass option available for additional stress reduction
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Supplied with protective liners for ease of use
- Product category:
- Thermal GAP PAD materials
Technologies:
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Gap pads [GAP PAD]
- Carrier type:
- Glass Fibre; Non-fiberglass
- Colour:
- Grey
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Standard thickness:
- 0.508 mm - 3.175 mm
- Thermal conductivity:
- 3.5 W/mK
- Young's modulus:
- 27.5 KPa (4.0 psi)
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