Part no. (SKU/IDH):
2591010
IDH Name:
BERGQUIST® GAP PAD® TGP 10000ULM, 8″x8″ dimension, 0.080″ thickness
Thermal GAP PAD Materials
Soft, electrically insulating pad with exceptional thermal conductivity
This high-performance, thermally conductive, silicone-based gap pad filler has an exceptional thermal conductivity rating of 10.0 W/m-K and ultra low modulus (ULM).
Part no. (SKU/IDH):
2591010
IDH Name:
BERGQUIST® GAP PAD® TGP 10000ULM, 8″x8″ dimension, 0.080″ thickness
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP PAD® TGP 10000ULM is designed for high-performance applications and provides excellent wet-out at the interface, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.
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Thermal conductivity: 10 W/m-K
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Ultra-low modulus design easily conforms and adheres to irregular surfaces
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Low compression stress
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High compliance, low compression stress
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Supplied with protective liners for ease of use
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermal management, gap pads
- Colour:
- Grey
- Operating temperature:
- -60.0 °C - 200.0 °C
- Thermal conductivity:
- 10.0 W/mK
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