Part no. (SKU/IDH):
2995572
IDH Name:
BERGQUIST® GAP FILLER TGF 2100LVO, Hobbok / pail
Thermal gap fillers
Next generation gap filler for electronic assembly applications
This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler is designed for control units and ADAS data module and other components, and offers highly reliable thermal management and robust processing.
Part no. (SKU/IDH):
2995572
IDH Name:
BERGQUIST® GAP FILLER TGF 2100LVO, Hobbok / pail
Packaging type Please make your selection Hobbok / pail
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 2100LVO is a 2-part, low-volatile silicone, room temperature curable gap filler suitable for use in a wide range of electronic assembly applications. With a minimum of 2.2 W/(m.K) thermal conductivity and excellent wet-out property, this versatile solution is the best choice to optimize heat dissipation in a wide range of electronics applications.
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Thermal conductivity: >2.2 W/(m∙K)
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Outstanding dispensing flow behavior
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High temperature stability
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Low volatility
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No D4-D10 compounds
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REACH compliant
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
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