Hot melt adhesives
High performance, solvent-free polyamide for high-temperature applications
This black, low viscosity, high-performance polyamide hotmelt adhesive is designed for low pressure molding applications and incidental solvent exposure. Perfect for higher temperature applications, such as automotive underhood.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TECHNOMELT® PA673 is an amber-colored, high performance thermoplastic polyamide specially designed to meet low pressure molding process requirements. It has a very short open time, and can be processed at low pressure due to its low viscosity, allowing encapsulation of fragile components without damage. Perfect for use in automotive underhood applications, where high service temperature performance is critical. Operating temperature is -40°F to 437°F (40°C to 140°C).
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Solvent-free
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Easy moldability
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Excellent environmental resistance
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Very short open time
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Operating temperature: -40°F to 437°F (40°C to 140°C)
- Product category:
- Hot melt adhesives
Technologies:
-
Hot Melts, polyamide
- Color:
- Amber
- Density:
- 0.98 g/cm³
- Melt viscosity, RVT, ASTM D 3236, @ 210.0 °C:
- 2800.0 mPa·s - 4000.0 mPa·s
- Softening point temperature:
- 185.0 °C
