Brochures

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

AI's growing demand in data centers drives the integration of high-performance chips like GPUs, FPGAs, and ASICs, which generate significant heat and power densities. Advanced thermal control and interconnect protection are crucial to enhance performance and ensure longevity in these high-power systems.

Key insights

The surge in AI demand in data centers necessitates advanced thermal and interconnect solutions to manage high heat and power densities for optimal performance and durability.
Thermal interface materials (TIMs) are essential for managing heat at the source in data centers, enhancing cooling efficiency and performance.
Henkel’s underfills and encapsulants protect high-density AI ICs from thermo-mechanical stress, ensuring reliability in demanding conditions.

Looking for solutions? We can help

Our experts are here to learn more about your needs.

Request a consultation

Looking for more support options?

Our support center and experts are ready to help you find solutions for your business needs.

Visit support center

Material solutions for AI data center

Key insights

Related products

Looking for solutions? We can help

Company

Help

Resource center

Social media