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Learn more about our thermal material management solutions in our product guide.
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To address the thermal demands of today’s electronic devices, Henkel has developed a complete portfolio of high-performance, user-friendly products. Effective control of heat is an increasing concern among today’s electronic device manufacturers and, as products become smaller, the need to dissipate damaging heat effectively will be greater than ever.
Of course, each application is unique and its requirements specific, which is why Henkel has formulated a comprehensive range of thermal management materials to suit a variety of current and future heat control needs.
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Uncover your unique heat dissipation & adhesion requirements -
Understand if a solid or liquid solution is best suited for your application -
Learn how gap size & topography can be an important consideration in making the right choice -
Different components withstand varying levels of stress and demand specific thermal management needs
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