Part no. (SKU/IDH):
2213988
IDH Name:
BERGQUIST® LIQUI BOND TLB SA2005RT, 50 ml Dual cartridge
Thermally conductive adhesives
Dispensable liquid for structural component bonding – high-performance
This 2-part silicone adhesive is designed for high-performance automotive electronics applications where thermal conductivity is needed.
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BERGQUIST® LIQUI BOND TLB SA2005RT, 50 ml Dual cartridge en_GLLIQUI BOND TLB SA2005RT PTB (3007646)IDH: 2213988
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BERGQUIST® LIQUI BOND TLB SA2005RT, 50 ml Dual cartridge en_GLLIQUI BOND TLB SA2005RT PTA (3007644)IDH: 2213988
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BERGQUIST® LIQUI BOND TLB SA2005RT, 50 ml Dual cartridge de_ATLIQUI BOND TLB SA2005RT PTB (3007646)IDH: 2213988
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BERGQUIST® LIQUI BOND TLB SA2005RT, 50 ml Dual cartridge de_ATLIQUI BOND TLB SA2005RT PTA (3007644)IDH: 2213988
Part no. (SKU/IDH):
2213988
IDH Name:
BERGQUIST® LIQUI BOND TLB SA2005RT, 50 ml Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB SA2005RT functions as a thermal interface material as well as a structural adhesive. It is ideal for demanding automotive applications like electronics, power supply pumps and automotive modules. This product is curable at room temperature. However, the cure rate can be accelerated with the application of heat.
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Thermal conductivity: 2.0 W/m-K
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High bond strength
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Adaptable cure mechanism
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High elongation modulus
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For information on our thermal management materials’ UL certifications, please refer to UL file E59150
- Product category:
- Thermally conductive adhesives
Technologies:
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Thermal management, speciality liquids
- Cure type:
- Heat cure; Room temperature (ambient) cure
- Operating temperature:
- -60.0 °C - 180.0 °C
- Shelf life:
- 6.0 mon.
- Storage temperature:
- 25.0 °C
- Thermal conductivity:
- 2.0 W/mK
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