Thermally conductive adhesives
Dispensable liquid for structural component bonding - high performance
This 2-part silicone adhesive is designed for high-performance automotive electronics applications where thermal conductivity is needed.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB SA2005RT functions as a thermal interface material as well as a structural adhesive. It is ideal for demanding automotive applications like electronics, power supplies pumps, and automotive modules. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat.
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Thermal conductivity: 2.0 W/m-K
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High bond strength
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Adaptable cure mechanism
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High elongation modulus
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermally conductive adhesives
Technologies:
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Thermal management, speciality liquids
- Cure type:
- Heat cure,Room temperature (ambient) cure
- Operating temperature:
- -60.0 °C - 180.0 °C
- Shelf life:
- 6.0 mon.
- Storage temperature:
- 25.0 °C
- Thermal conductivity:
- 2.0 W/mK
