Discover electrically and non-electrically insulating silicone thermal interface materials in a conformable, easy to apply pad format with SIL PAD® materials.
SIL PAD® products can be used in a wide range of applications. Choose the ideal product from the portfolio for your needs. Discover products available with or without adhesives, as well as silicone thermal interface and non-silicone material alternatives. SIL PAD® products are available to buy in several formats, including rolls, sheets, tubes, and as custom die-cut parts. Explore the full range:
SIL PAD® thermal materials provide good thermal performance and are simple in application. Watch the video for more details on the qualities and benefits of SIL PAD® thermal materials.
SIL PAD® thermal conductivity products are soft, conformable thermal pads that improve heat dissipation in a range of electronic assemblies.
They minimize thermal resistance from the external package of a power semiconductor to the heat sink, electrically isolating the semiconductor from the heat sink and providing sufficient dielectric strength to withstand high voltage.
Designed to maximize thermal performance, they are also strong enough to resist puncture from the facing metal surface.
Supplied in rolls, Bergquist® SIL PAD® materials are also applicable to a fully automated pick-and-place process.
Bergquist® SIL PAD® thermally conductive insulators are designed to be clean, grease-free, and flexible. The combination of a tough carrier material, such as conformable fiberglass and silicone rubber, provides a more versatile material than mica or ceramics and grease.
The Bergquist® SIL PAD® product portfolio is available in multiple thicknesses. Each product is highly flexible and conformable. Choose between a wide range of thermal conductivity and dielectric strengths to suit many applications.
Bergquist® SIL PAD® interface materials are designed to perform. They comprise proven silicone rubber binders to help aid production. Being fully flexible and conformable makes them applicable to components with multi-level or sloped topographies. They are also reinforced to resist cut-through.
At Henkel, we always look to ensure you have the right product for every application. Our technical specialists will work closely with you to find out the details of your assembly, before helping you find the right SIL PAD® products for use in your devices.
Thermal performance
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Offering excellent thermal performance with minimized SIL PAD® thermal resistance.
No mess
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Eliminating the need for messy thermal grease products. Easier and cleaner to apply.
Higher durability
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Offering higher durability levels than mica alternatives.
Reduced cost
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Reducing cost compared to ceramic thermal management options.
Electrical shorting resistance
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Providing excellent resistance to electrical shorting.
Decreased thermal resistance
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Under time and pressure, thermal resistance will decrease.
The SIL PAD® product you need will depend on the needs of your specific application. Some SIL PAD® materials have custom features, with thousands of options.
Explore all our SIL PAD® products and find the one that is right for your application.
The large portfolio of SIL PAD® thermally conductive insulators is extremely versatile. In today’s marketplace, SIL PAD® materials are used to manage heat effectively in virtually every component of the electronics industry, including:
- The interface between a power transistor, CPU, or other heat-generating component and a heat sink or rail.
- To isolate electrical components and power sources from the heat sink or mounting bracket.
- As an interface for discrete semiconductors requiring low-pressure spring-clamp mounting.
- SIL PAD® products support the assembly process as well as making pre-applied processes possible. For applications that require a strong structural bond, Bergquist® thermal adhesives are recommended.
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