Expert talks: thermal management assemblies technical webinar

Learn how Henkel solutions can protect temperature-sensitive components on a circuit board to ensure optimum performance.

Henkel’s Thermal Interface Materials (TIM) are a proven solution used for decades as a method to successfully pull heat away from temperature-sensitive components on a circuit board to ensure optimum performance.

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Summary

Managing heat on electronic assemblies is a major concern of engineers. Henkel’s Thermal Interface Materials (TIM) are a proven solution used for decades as a method to successfully pull heat away from temperature-sensitive components on a circuit board to ensure optimum performance.

Key insights

Excessive heat can reduce performance and reliability of assemblies, leading to catastrophic failure.
Air must be replaced with Thermal Interface Materials to facilitate heat transfer from component to environment.
Gap pad, gap filler, phase change, gel and thermal adhesives are thermal management solution options for electronic assemblies.

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Expert talks: thermal management assemblies technical webinar

Learn how Henkel solutions can protect temperature-sensitive components on a circuit board to ensure optimum performance.

Summary

Key insights

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Expert talks: thermal management assemblies technical webinar

Learn how Henkel solutions can protect temperature-sensitive components on a circuit board to ensure optimum performance.

Summary

Key insights

Related content

How to choose the right wear prevention solution?

Don't let wear, wear you down. Learn more about our wear prevention solutions in our product guide.

Introducing LOCTITE® PC 7332™ for protection against higher intensities of wear

Don't let wear, wear you down. Learn more about our new wear-resistant compound in our white paper.

Looking for solutions? We can help

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Help

Resource center

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Introducing LOCTITE^® PC 7332^™ for protection against higher intensities of wear