Our new research report uncovers three forces that drive next-gen innovation: rising regulatory pressure, performance complexity, and sustainability expectations. The key takeaway from 170 semiconductor manufacturers that serve telecommunication networks? Highly engineered materials are integral for successfully boosting connectivity.
Flawless reliability. Lightning-speed data processing. End-to-end compliance. Semiconductor leaders across the telecom industry face a list of tough-to-meet demands.
In our latest research report, 170 respondents voiced their need for highly engineered material solutions to enable semiconductor packaging and assembly in telecommunications networks. 65.3% mentioned gap fillers for large packaging gaps as being either ‘very’ or ‘extremely’ important. If you want more answers, this 5-min read unpacks how today’s design decisions shape tomorrow’s networks — and how advanced packaging is answering the call.
This is where highly engineered materials make an impact
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