White paper
Discover how small heat reductions at the component level can significantly enhance NVIDIA's cooling, performance, and durability.
As active cooling measures reach their limit, effective thermal management in hardware components becomes increasingly critical, not only for maintaining performance but also for driving future innovations.
Collaboration between NVIDIA and Henkel focuses on selecting the right thermal materials for routers, switches, and circuit boards, which is essential to reducing heat and unlocking the full potential of tomorrow’s 5G, Wi-Fi 6, and 400 GbE data transmission rates.
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There is no limit to what NVIDIA and Henkel can achieve together. Reach out and let's start a conversation!