Discover how thermal adhesives are revolutionizing electronics by combining strong structural integrity with efficient heat dissipation - no screws or clips required.
As devices shrink and power demands soar, traditional thermal interface materials often struggle to keep up. But what if you could achieve both strong structural integrity and efficient heat dissipation - without screws or clips? In this episode, we’ll explore how dual-function thermal adhesives are transforming design possibilities, improving performance, and streamlining production. Whether you're in EVs, aerospace, lighting, or industrial electronics, this is a discussion you won’t want to miss.
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Milad Amin is an Application Engineer at Henkel, specializing in thermal interface materials (TIMs) within the company’s Adhesive Technologies business unit. Milad, who has an impressive thermal design and engineering background, joined Henkel in 2023 and is focused on technical customer support, product application development, and collaboration with sales and marketing teams to deliver optimized thermal solutions for customers.
Broad experience in the electronics, power, and industrial markets underpin Milad’s unique insight and his drive to help customers select the most appropriate thermal solution for their application. He is passionate about bridging technical expertise with commercial strategy to secure customer and business success.
Milad holds a bachelor’s degree in mechanical engineering and a master’s in computational thermofluid engineering from The Friedrich-Alexander University of Erlangen-Nuremberg. He is based in Henkel’s Düsseldorf headquarters in Germany.
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