Packaging is a crucial determinant of power, performance and cost. New packaging requirements—thinner wafers, smaller footprints, package integration, 3D designs and wafer-level technology—deliver higher-performing microelectronics. Cutting-edge materials enable wire bond and advanced semiconductor packaging applications.
Automotive, communications and data centres demand more performance from semiconductor technology. As size decreases, performance must increase. Henkel materials are helping elevate semiconductor packaging to meet these needs.
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Printable die-attach materials provide a viable alternative to standard die attach paste processes, allowing the application of adhesive at the wafer level.
Strong die-to-substrate and die-to-die bonds are the foundation of robust semiconductor packages.
Protection of ICs, particularly as dimensions continue to shrink and more direct chip attach is incorporated, is critical for long-term semiconductor device reliability.
Die-attach film adhesives have become essential for the production of next-generation semiconductor packages.
Wire bonding is a stronghold of semiconductor technology, providing flexibility and cost advantages within an established infrastructure. New automotive applications are fuelling growth in wire bond packaging.
Wafer-level packaging applications have seen explosive growth as they continue to be key enablers of innovation in mobility products, consumer electronics, data processing and IoT applications, among others.
The convergence of advanced RF communication capability, miniaturisation and package-level integration underscore the requirement for novel approaches to EMI shielding.
Higher I/O counts, package integration and tighter bump pitches are dictating the use of flip-chip technology to enable advanced package designs.
Advanced flip-chip technology and heterogeneous integration are key enablers of high-performance computing, driving new levels of processing power for desktops, data centre servers, autonomous driving systems and more.
Advanced packaging techniques meet intensifying demands for applications like flip chip, wafer-level packaging and memory 3D TSVs. With miniaturised form factor and processing power, advanced packaging enables system-level integration, higher functionality and faster performance.
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