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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Compounds for electronics

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  • A packshot of TECHNOMELT PA 638 BLACK showing a 20KG bag.

    Injection molding compounds

    TECHNOMELT® PA 638 BLACK

    High-performance thermoplastic polyamide for low-pressure molding 

  • A packshot of TECHNOMELT PA 678 showing a 20KG bag.

    Injection molding compounds

    TECHNOMELT® PA 678

    Polyamide hotmelt for low-pressure molding applications 

  • Potting compounds

    LOCTITE® SI 5710

    Ultra-clear, health and safety friendly, silicone potting adhesive

  • Potting compounds

    LOCTITE® CR 6127

    Solvent-free, urethane casting resin

  • Potting compounds

    LOCTITE® CR 4300

    Isocyanate-based casting resin hardener

  • A packshot of LOCTITE ECCOBOND FP4470, a black material in 3 different sizes showing a 6OZ semco cartridge, a 30CC syringe, and a 10CC syringe.

    Encapsulants

    LOCTITE® ECCOBOND FP4470

    Epoxy encapsulant for fine pitch wires and deep cavities 

  • Black drum with metal lid showing a white label with copy and hazardous pictorgrams

    Potting compounds

    LOCTITE® UK 5400

    Solvent-free pasty adhesive for the production of sandwich elements

  • Potting compounds

    LOCTITE® SI 5140

    Silicone-based potting compound and sealant