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Henkel Adhesive Technologies
Injection molding compounds
TECHNOMELT® PA 638 BLACK
High-performance thermoplastic polyamide for low-pressure molding
TECHNOMELT® PA 678
Polyamide hotmelt for low-pressure molding applications
Encapsulants
LOCTITE® ECCOBOND FP4470
Epoxy encapsulant for fine pitch wires and deep cavities