Safeguarding function and extending the useful life of electronic systems are vital to protecting investment. Henkel’s high-performance materials like PCB conformal coatings, board level underfills, three-step low pressure molding, and rugged potting materials defend electronics against various contaminants and environmental exposure extremes, securing operational reliability and prolonging useful lifetime.
Simple as 1-2-3
Low pressure molding is an easy three- step encapsulating process ideal for delicate electronics. No housing necessary.
Under the hood and into outer space
When PCBs are destined for high-reliability applications like automotive and aerospace, potting electronic subsystems provides optimal protection.
Surrounded
Thorough encapsulation of electrical interconnects is vital to mechanical integrity and reliability. Void-free, high-flow, fast cure Henkel underfills get the job done.
Nearly every aspect of modern life is affected by electronics in some way. People depend on technology for work, play, health, and comfort. Disruption, inconvenience, and even life-threatening conditions can result when electronics fail. Protection materials are some of the most vital elements of next-generation electronic system design. Whether it’s underfill encapsulants to secure electrical connections, rugged potting formulations for harsh environments, or conformal coatings to deliver high-power system reliability, integrating protection materials is non-negotiable.
Electronic protection solutions come in many forms and are designed to further enhance the inherent structure, operation, and reliability of electronic assemblies and systems. Though they are not considered functional (i.e., electrical function), protective materials are essential for maximizing electronic component performance and lifetime. These materials come in many forms and provide various elements of fortification from environmental stress and contamination.
Extreme heat and cold. Dust, chemicals, and other contaminants. Moisture. Vibration. Mechanical shock. Electronic devices may experience one or all of these conditions within their applications. Integrating high-performance protection materials helps shield electronics from the effects of challenging environments, fortifying their operational stability and dependable function.
Throughput and mass production
Fast flow characteristics and quick curing capability enable high throughput, high yield production.
Ease-of-use
Simple application, compatibility with multiple types of deposition equipment, and a wide range of options put control where it belongs: back in the hands of the manufacturer.
Versatility
Whether the application demands material reworkability, electrical insulation, or compliance with demanding aerospace, automotive, or medical standards, Henkel’s expansive portfolio has a solution that’s up to the task.
Every application has unique requirements. Henkel’s technical team has the experience and know-how to help select the most appropriate protection solutions for application-specific demands. With broad chemistries, multiple cure options, and unmatched portfolio variety, Henkel’s aim is to deliver a solution with value, not just a product.
- Potting compounds
- Low pressure molding
- Conformal coatings
- Underfills
- Board-level encapsulants
Liquid potting materials are the go-to protection solution for electronics subjected to the harshest environments. Encapsulating complete electronic assemblies with potting compounds offers the ultimate defense against shock, vibration, liquids, chemicals, and corrosion. For certain applications like aerospace, automotive, and industrial manufacturing, reliability standards demand the protection offered only through potting. These materials provide mechanical strength, electrical insulation and, in some cases, also offer heat dissipation capabilities.
Low pressure molding materials ideal for delicate electronics, small electronic devices, LEDs, connectors, cables, wires, or any device that requires encapsulation without a housing. TECHNOMELT® and LOCTITE® low pressure molding materials are simple to process, primarily formulated with bio-renewable raw materials sources, and provide insulation. These encapsulants are waterproof, vibration and impact resistant, and produce very little waste.
Printed circuit boards (PCBs) are at the heart of electronic system function. Conformal coatings protect them from corrosion-inducing contaminants or other damaging conditions to safeguard reliable function, defend against electrical failures or voltage leaks, and ensure a long lifetime. Thin, solvent free conformal coatings from Henkel are available in multiple chemistries to satisfy the demands of many high-reliability applications, including aerospace, industrial manufacturing, automotive, and telecom, to name a few.
Underfill encapsulants help secure the integrity of array and flip-chip devices by limiting the effects of thermo-mechanical stress to maintain electrical connection. Henkel’s award-winning LOCTITE underfills are available in full capillary flow, edge and corner bond. Processability, no-voiding, reworkability, flow rates, and cure speeds are all important considerations when selecting an underfill material.
In certain circumstances, bare chips – chips that are not encased in a molded package – that are assembled onto a printed circuit board require an extra layer of protection to ensure application reliability. In these cases, glob top and dam and fill encapsulants are the materials of choice. Once the chips are encapsulated, no other molding or protective materials are typically needed. This is a cost-effective way to defend against thermal shock, mechanical damage, and harsh chemicals that may impact performance. Often employed with wire-bonded die, chip-on-board encapsulants must be formulated for precision deposition to control volume and shape.
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