Part no. (SKU/IDH):
1859304
IDH Name:
LOCTITE® ECCOBOND NCP 5209, 10 cc Syringe
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Non-conductive, pre-applied underfill adhesive for thermal compression
This yellow non-conductive die-attach adhesive is designed for thermal compression bonding processes in flip-chip to laminate assembly.
Part no. (SKU/IDH):
1859304
IDH Name:
LOCTITE® ECCOBOND NCP 5209, 10 cc Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip-chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. It cures fast when exposed to heat.
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Low ionic impurities
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Fast curing
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Non-conductive
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Offers excellent protection of electrical joints
- Coefficient of thermal expansion (CTE), Above Tg:
- 80.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 28.0 ppm/°C
- Extractable ionic content, Chloride (CI-):
- 10.0 ppm
- Extractable ionic content, Potassium (K+):
- 10.0 ppm
- Extractable ionic content, Sodium (Na+):
- 10.0 ppm
- Glass transition temperature (Tg):
- 145.0 °C
- Storage modulus, DMA, @ 25.0 °C:
- 7.3 GPa (7300.0 N/mm², 1058775.0 psi)
- Storage temperature:
- -40.0 °C
- Viscosity, @ 25.0 °C:
- 12500.0 mPa·s (cP)
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