Part no. (SKU/IDH):
2811435
IDH Name:
LOCTITE® ECCOBOND UF 9000AG, 30 cc Syringe
Underfills
Underfill encapsulant for flip-chip BGA and Cu pillars
A 1-part, epoxy-based, black, high-purity underfill encapsulant that is for flip-chip Ball Grid Array (BGA) and Cu pillar package applications.
Part no. (SKU/IDH):
2811435
IDH Name:
LOCTITE® ECCOBOND UF 9000AG, 30 cc Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
- Description
- Technical specification
LOCTITE® ECCOBOND UF 9000AG is a black, high purity semiconductor underfill encapsulant. It’s typically used for flip-chip BGA and Cu pillar package applications requiring low thermal expansion, fast capillary flow and long work life. It exhibits low resin bleed-out and low die warpage and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. It is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, protective seal that dissipates stress in solder joints and extends thermal cycling performance.
-
Good flow with self-filleting
-
High purity
-
Low coefficient of thermal expansion (CTE)
-
Low resin bleed-out
- Product category:
- Underfills
Technologies:
-
Electronics semiconductor materials
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
Every question, request, and challenge is an opportunity for us to help your business perform. And we have all the right people ready to make it happen.
Check our FAQ for quick answers or reach out via phone to our support center. Here, we also offer additional inquiry forms to help you connect with the appropriate Henkel expert.