When miniaturization, precision, and extreme bondline control are required, die attach film is the go-to solution for die-to-substrate, die-to-leadframe, and die-to-die bonding. The dimensional precision afforded by die attach film enables thinner, higher-density, high-reliability semiconductor packages.
Die attach films are specialized adhesives that bond semiconductor dies to substrates, leadframes, or other dies for die stacking. The materials, available in electrically conductive and non-electrically conductive formulations, are thin, flexible films that are laminated onto the wafer; once dies are singulated, they facilitate die bonding at elevated temperatures.
Die attach film is most often employed in applications that require tight die-to-pad ratios, uniform bondlines, clean processing, and ultra-thin die integration. Die attach films also support operationally efficient mass production, providing an alternative to serial dispensing processes when applicable. These die attach adhesives are used across industries for a variety of wirebond package types.
Pioneer of conductive die attach film
Henkel engineered the market’s first-ever conductive die attach film, establishing the benchmark for this important wirebond semiconductor packaging material category.
High thermal conductivity
Die attach films are available in a range of thermal conductivities, addressing the challenging heat dissipation requirements of emerging devices.
Automotive grade reliability
Henkel non-conductive die attach films offer good processability and are auto grade 0 capable for small die leadframe applications, while most conductive films offer automotive grade 0 capability.
Multiple considerations impact the selection of an appropriate die attach film solution. Among others, die size, die thickness, material adhesion strength, thermal and electrical conductivity, coefficient of thermal expansion, and processing requirements are important factors. Consultation with a Henkel materials specialist will help ensure the most appropriate die attach film for the application is selected.
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