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Discover how hidden but vital material innovations are making the micro-sized “brains” of modern electronics smarter, better, and more reliable.

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This animation illustrates the assembly process of constructing a semiconductor chip on a circuit board.

Across automotive, data center, 5G and personal devices, explore how essential yet unseen material innovations are enhancing the intelligence, efficiency, and reliability of semiconductors, the micro-sized “brains” of modern electronics.

Automotive

Semiconductors are at the heart of automotive advancements, driving the evolution of electric and autonomous vehicles. The need for higher power efficiency and thermal management in EVs and AVs has led to the adoption of wide bandgap materials like SiC and GaN, requiring novel sintering-based die-attach materials.

Data center with AI/HPC

The future of data centers lies in advanced semiconductor designs that support the immense demands of AI and high-performance computing (HPC). As traditional methods reach their limits, cutting-edge packaging and materials are stepping in to ensure both reliability and efficiency.

5G, Wi-Fi, telecom, and personal devices

5G and advanced Wi-Fi technologies are transforming connectivity, increasing the demand for more powerful and reliable semiconductors. With personal electronic devices becoming smaller and more complex, new challenges emerge in managing heat and maintaining performance.

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Automotive

Data center with AI/HPC

5G, Wi-Fi, telecom, and personal devices

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