Part no. (SKU/IDH):
2793356
IDH Name:
LOCTITE® ECCOBOND UF 1173, Syringe
Underfills
Void-free epoxy underfill
This epoxy-based formulation is a uniform and void-free encapsulant underfill.
Part no. (SKU/IDH):
2793356
IDH Name:
LOCTITE® ECCOBOND UF 1173, Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ECCOBOND UF 1173 is a 1-part, epoxy-based underfill, which maximises the device’s temperature cycling capability, distributing stress away from solder connectors and thus enhancing solder joint reliability in Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It has a long pot life and exhibits low CTE properties to improve bond strength and stability. Ideal for void-free encapsulation of electronic packages.
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Void-free
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Low coefficient of thermal expansion (CTE)
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48-hour pot life at 25°C (77°F)
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Colour:
- Black
- Cure type:
- Heat cure
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