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Henkel Adhesive Technologies
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP 1600S
Electrically insulating pad – general purpose
Thermally conductive adhesives
LOCTITE® 315
Self-shimming, thermally conductive, controlled-strength activator-cured paste
LOCTITE® 384
Thermally conductive adhesive for bonding heat-generating electronic components
Thermal gap fillers
BERGQUIST® TGF 3010APS
High performance dispensable liquid for e-Mobility battery applications
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 10000ULM
Soft, electrically insulating pad with exceptional thermal conductivity
BERGQUIST® GAP PAD® TGP 12000ULM
Extremely soft electrically insulating pad with exceptional thermal conductivity
Thermal gels
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
BERGQUIST® GAP PAD® TGP 1000VOUS
Ultra soft, fibreglass-reinforced insulation pad – high voltage applications
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
Phase change materials
BERGQUIST® HI FLOW THF 1600P
High-performance, electrically insulating, reinforced pad
BERGQUIST® GAP PAD® TGP 5000
Soft, fibreglass-reinforced insulation pad – high performance
BERGQUIST® SIL PAD® TSP 1800
Electrically insulating, fibreglass-reinforced – exceptional performance
