Die attach paste capability is a key factor in ensuring semiconductor package performance and reliability. These materials deliver mechanical strength to alleviate physical stress, while also providing crucial thermal control and, in some cases, electrical connection between the die and package.
Used in leadframe and laminate wirebond semiconductor devices, die attach pastes bond dies to substrates or packages to form a strong mechanical bond that allows the die to withstand handling, package assembly, and in-use stress. Beyond providing die stability and a critical thermal pathway for heat dissipation, electrically conductive pastes enable electrical connection between die and package, while non-conductive pastes provide electrical insulation.
In the packaging of wirebond semiconductor devices, die attach pastes serve multiple functions, including mechanical stability, thermal control, and electrical connectivity. While other die attach formats, such as film, are available, die attach pastes are often selected when production flexibility is paramount, high thermal conductivity is critical, and larger dies or irregular surfaces are used.
High thermal and sintering innovation
High thermal conductivity die attach solutions, including pressure-less and pressure-assisted sintering materials, provide exceptional heat dissipation to take power devices to new levels of performance.
Broad die and substrate compatibility
Wide substrate, die finish, and die size compatibility ensure Henkel die attach materials offer flexibility while addressing market needs for high-reliability, cost-competitive packages.
Proven process and performance
Henkel’s expansive die attach portfolio with proven process and performance, including automotive grade standards, addresses numerous wirebond application scenarios.
There are several factors that influence die attach paste selection, including die size and thickness, backside metallization, die/substrate/die attach material thermal expansion values, substrate material, operating temperature range, and application reliability requirements, among others. Henkel technical experts and application engineers can provide guidance to match your application with the ideal die attach solution.
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