Electrically non-conductive adhesives
Electrically non-conductive, die attach adhesive designed to minimize stress
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Rating & reviews
- Question & answer
When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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Electrically non-conductive
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1-part: no mixing required
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Fast cure
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Low cure temperature
- Product category:
- Die attach adhesives
- Technologies:
- Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 54.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 128.0 ppm/°C
- Cure schedule, Recommended, @ 110.0 °C:
- 90.0 sec.
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 29.0 ppm
- Extractable ionic content, Potassium (K+):
- 19.0 ppm
- Extractable ionic content, Sodium (Na+):
- 89.0 ppm
- Glass transition temperature (Tg):
- 120.0 °C
- Hot die shear strength:
- 7.0 kg-f
- Key characteristics:
- Conductivity: electrically non-conductive
- RT die shear strength:
- 25.0 kg-f
- Tensile modulus, DMTA, @ 25.0 °C:
- 68.0 N/mm² (10000.0 psi)
- Thermal conductivity:
- 0.35 W/mK
- Thixotropic index:
- 4.2
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 11000.0 mPa·s (cP)
