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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Electrically non-conductive adhesives

LOCTITE® ABLESTIK 2035SC

Electrically non-conductive, die attach adhesive designed to minimize stress

This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).

  • Product category:
  • Die attach adhesives

Technologies:

  • Applications:
  • Die attach

 

  • Coefficient of thermal expansion (CTE):
  • 54.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 128.0 ppm/°C

 

  • Cure schedule, Recommended, @ 110.0 °C:
  • 90.0 sec.

 

  • Cure type:
  • Heat cure

 

  • Extractable ionic content, Chloride (CI-):
  • 29.0 ppm

 

  • Extractable ionic content, Potassium (K+):
  • 19.0 ppm

 

  • Extractable ionic content, Sodium (Na+):
  • 89.0 ppm

 

  • Glass transition temperature (Tg):
  • 120.0 °C

 

  • Hot die shear strength:
  • 7.0 kg-f

 

  • Key characteristics:
  • Conductivity: electrically non-conductive

 

  • RT die shear strength:
  • 25.0 kg-f

 

  • Tensile modulus, DMTA, @ 25.0 °C:
  • 68.0 N/mm² (10000.0 psi)

 

  • Thermal conductivity:
  • 0.35 W/mK

 

  • Thixotropic index:
  • 4.2

 

  • Viscosity, Brookfield CP51, @ 25.0 °C:
  • 11000.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

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