Across 5G, enterprise Wi-Fi, and broadband fiber access, broadband connectivity is increasingly challenged to deliver higher processing power, faster speeds, and greater bandwidth. At the same time, costs and power usage are rising, putting pressure on profitability.
Telecommunications networks, such as 5G, must deliver high speeds with reliable performance, elevating the demand for functional components to new levels. Innovative materials help reduce heat, improve bonding, and protect components. Here's how.
- Article
- Infographic
- 5G: RRUs + Fixed Wireless Arrays
- 5G: Base Stations
- Enterprise Wi-Fi: Indoor Access Point
- Enterprise Wi-Fi: Outdoor Access Point
- Optical Line Terminal
- Optical Network Unit
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Telecom infrastructure components are located in outdoor environments, thus ensuring reliable long-term performance is critical. For dependable function, these components rely on strong electrical interconnects and robust thermal management solutions.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.
To ensure reliable 5G, telecom base stations must provide dependability and longevity. Telecom infrastructure functions in outdoor environments and must withstand environmental conditions, in-operation stress, moisture, and corrosion while maintaining strong electrical interconnects.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Fixed wireless access helps secure fast and seamless connectivity to boost 5G efficiency. The effectiveness of access points depends largely on the materials used to connect electronics, remove operational heat, and secure components.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
Outdoor wireless access points must withstand environmental stresses as they work to bolster 5G connectivity and efficiency. The performance of access points relies on the materials used to connect electronics, remove heat, and secure components.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.
BERGQUIST® LIQUI-BOND liquid adhesives are high performance, thermally conductive, liquid adhesive materials. These form-in-place elastomers are ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink.
Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Optical components, like OLT and ONU, convert electrical signals to fiber optic signals, or vice versa. All optical adhesives must be formulated for maximized light transmittance. In addition, optoelectronic materials must provide high bond strength, minimal shrinkage on cure, and high resistance to humidity.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
BERGQUIST® LIQUI-BOND liquid adhesives are high performance, thermally conductive, liquid adhesive materials. These form-in-place elastomers are ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink.
Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.
LOCTITE® thermal adhesives are designed to provide excellent heat dissipation for thermally-sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application specific requirements and ease-of-use.
Fiber optic networks use OLT and ONU components at different points in the network to convert signals between electrical and fiber optic. Optoelectronic material must be formulated for maximized light transmittance, high bond strength, minimal shrinkage on cure, and high resistance to humidity.
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