Electrically non-conductive adhesives
Non-conductive adhesive for high-throughput smart cards
A 1-part, red, non-conductive die-attach adhesive for high throughput smart card bonding applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Rating & reviews
- Question & answer
LOCTITE ABLESTIK 2033SC is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for high-throughput smart card bonding applications. It’s compatible with various encapsulant chemistries. It has a long work life, exhibits minimal resin bleed-out (RBO), and cures fast when exposed to heat.
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Fast curing
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Non-conductive
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Excellent resin bleed-out performance
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Long work life
- Product category:
- Die attach adhesives
- Technologies:
- Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 56.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 133.0 ppm/°C
- Cure schedule, Alternate 2, @ 150.0 °C:
- 10.0 sec.
- Cure schedule, Alternate, @ 120.0 °C:
- 60.0 sec.
- Cure schedule, Recommended, @ 110.0 °C:
- 90.0 sec.
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 29.0 ppm
- Extractable ionic content, Potassium (K+):
- 4.0 ppm
- Extractable ionic content, Sodium (Na+):
- 14.0 ppm
- Glass transition temperature (Tg):
- 46.0 °C
- Key characteristics:
- Cure speed: fast cure,Stress: low stress
- Tensile modulus, DMTA, @ 200.0 °C:
- 60.0 N/mm² (8600.0 psi)
- Thixotropic index:
- 6.1
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 11300.0 mPa·s (cP)
