Electrically non-conductive adhesives
Medium to high dispense speed, non-conductive surface mount adhesive
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
If you’re looking for a surface mount adhesive with medium to high dispense speeds, choose LOCTITE® 3609. This epoxy-based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead-free wave solder with both water-based and alcohol-based fluxes.
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Medium to high dispense speeds
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1-part: no mixing required
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Electrically non-conductive
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Surface mount adhesive
- Product category:
- Electrically non-conductive adhesives
Technologies:
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Thermosets, electronics assembly materials
- Color:
- Red
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Physical form:
- Gel
- Shear strength, Steel (grit blasted):
- 1450.0 psi
- Storage temperature:
- 2.0 °C - 8.0 °C
- Viscosity, cone & plate Haake PK100, M10/PK1, 2°:
- 0.16 Pa∙s - 20.0 Pa∙s
