BERGQUIST^® GAP PAD^® TGP 40000SF

BERGQUIST^® GAP PAD^® TGP 40000SF is a silicone-free thermal interface material designed for demanding thermal management applications. It is ideal for 5G telecom and datacom equipment, DSPs in optical transceivers, GPUs and CPUs in high-performance computing, immersion cooling for AI accelerators, vehicle control units and sensors for ADAS, aerospace and defense electronics, and LEDs and lasers. It supports ease of handling, assembly, and disassembly, and offers low bleed and low outgassing characteristics. Thanks to its oriented filler technology, it delivers an ultra-high thermal conductivity of 40 W/m · K and exceptional thermal performance at typical pressures. It is available in multiple standard thicknesses from 20 to 125 mil and can be supplied with optional one-sided PSA for enhanced handling and fixturing.