BERGQUIST^® GAP FILLER TGF 1500

BERGQUIST GAP FILLER TGF 1500 is a 2-part, high performance, thermally conductive liquid gap filler featuring superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature, or faster with the addition of heat. Unlike cured thermal pad materials, a liquid offers infinite thickness variations with little or no stress to the sensitive components during assembly. You can also expect low level natural tack. Once cured, this product provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps.