TECHNOMELT^® PA 6771 BLACK is a 1-part polyamide hot melt adhesive specially designed for low pressure molding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. It is a resilient encapsulant with great heat stability, UV stability, and moisture resistance. Perfect for potting electronics modules, molding strain relief into wiring, and encapsulation of sensors, especially in outdoor applications. This is a versatile adhesive for a variety of substrates, including FR4, metals, and plastics including ABS, PC.