Hot melt adhesives
White polyamide hot melt for molding applications
A 1-part, white, polyamide hot melt adhesive for molding applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TECHNOMELT® PA 668 WHITE is a white, polyamide-based hot melt adhesive for molding applications. Its creep resistance temperature stands at 130°C (266°F), and it resists temperature to a softening point of 150°C to 162°C (302°F to 323°F). TECHNOMELT PA 668 WHITE has an application temperature range of 180°C to 230°C (356°F to 446°F) and cures by physical setting into a thermoplastic condition of the bond area.
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Application temperature: 180°C to 230°C (356°F to 446°F)
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Cures by physical setting
- Product category:
- Hot melt adhesives
Technologies:
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Hot Melts, polyamide
- Applications:
- Encapsulating
- Color:
- White
- Elongation, at break:
- 600.0 %
- Melt viscosity, RVT, ASTM D 3236, @ 210.0 °C:
- 3000.0 mPa·s (cP) - 4200.0 mPa·s (cP)
- Number of components:
- 1 part
- Shore hardness, ISO 868/15s, Shore A:
- 90.0
- Softening point temperature:
- 155.0 °C
