Case study

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

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This is a futuristic concept image of a server in a data center.

Challenge

Data center switches, routers, and servers are incorporating larger, more powerful CPUs/GPUs to manage increasing data processing and bandwidth demands. The new semiconductor packages, many containing multiple large dies, are seeing higher power concentrations, resulting in elevated operational temperatures. At the same time, new generations of switch, router, and server designs are becoming more compact, which limits the thermal material types that are effective with very thin bond lines.

Results

A new silicone-free, phase change TIM has been developed by Henkel that delivers thin bond line capability with low-pressure and low thermal impedance for large die processors and high-power applications.
The material has been tested and validated for a wide power range of up to 800 W.

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Phase change interface materials for next-gen data center ICs

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