Brochures
Discover Henkel's comprehensive portfolio of advanced materials for various wirebond requirements – from smaller die-to-pad ratios to thinner bond lines to low-stress to high-temperature capability and robust adhesion.
From die attach pastes and films, encapsulants, package-level EMI shielding materials, to alternative wafer backside coating (WBC) die attach solutions, Henkel delivers the process adaptability, cost-effectiveness and in-field reliability necessary for today's advanced wirebond ICs.
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