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Learn about Henkel’s expansive portfolio of high thermal die attach adhesives catered for various package types, die sizes, application reliability criteria, and processing preferences.
With thermal conductivity ranging from 20 W/m-K to 165 W/m-K and in formulations that span traditional pastes to pressure-less and pressure-assisted sintering, Henkel high thermal die attach materials deliver proven performance supported by global R&D resources and a team of semiconductor packaging experts.
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