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Learn about Henkel's comprehensive solutions to meet the demanding automotive applications for high-reliability and high thermal die attach materials including traditional pastes, films and pressure-less sintering materials, as well as underfills and liquid molding and encapsulation materials.
Automotive semiconductor technology is mission-critical, requiring automotive grade high reliability, and addressing the converging demands of increased function, tight dimensional requirements, thermal control, and fail-safe, long-term performance. Henkel’s high-reliability semiconductor materials for wire bond and advanced packaging devices meet the challenging and dynamic conditions for next-generation.
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