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Henkel Adhesive Technologies

Data center semiconductor insights

Beyond research

In our newest research report, we've asked 120 semiconductor engineers and manufactures from the data center industry what performance requirement they deem the most pressing. Explore the findings, and gt a new perspective on how to harness the potential of the current AI revolution.

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Powering the semiconductor revolution

Our survey is a great way to get a fresh perspective on what drive the ongoing and AI-powered surge of innovation. Catch it to get familiar with what keeps your peers going and what keeps them up at night. From top data center semiconductor performance requirements to what kind of highly engineered materials types are needed for advanced packaging solutions.

Fitter, snappier, more productive

Increased performance and more sustainable processes are key for success. The is a central conclusion in our research report about AI and the rise of data centers.

But instead of treating these two objectives separately, focusing on the synergy between them creates a range of new design and manufacturing opportunities. Highly engineered materials play a pivotal role as critical enablers.

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This is where our applications make an impact

How do we change the game with adhesives. Click and find out.

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Setting new standards

Scientific advancement is born out of free thinking. We encourage you to share your thoughts and ideas with us.