Brochure
Learn about Henkel's comprehensive solutions to meet the demanding automotive applications for high-reliability and high thermal die attach materials including traditional pastes, films and pressure-less sintering materials, as well as underfills and liquid molding and encapsulation materials.
Automotive semiconductor technology is mission-critical, requiring automotive grade high reliability, and addressing the converging demands of increased function, tight dimensional requirements, thermal control, and fail-safe, long-term performance. Henkel’s high-reliability semiconductor materials for wire bond and advanced packaging devices meet the challenging and dynamic conditions for next-generation.
-
-
-
Our experts are here to learn more about your needs.
Our support center and experts are ready to help you find solutions for your business needs.