In automotive controls, aerospace and satellite systems, medical devices, and many industrial applications, wirebond semiconductor packaging remains the standard. As one of the most mature, proven, and well-understood semiconductor packaging approaches, wirebond offers reliability for mission-critical applications where harsh environments are the norm and cost-effectiveness is essential.
Wafers are thinner, die dimensions smaller, and heterogeneous integration designs like system-in-package (SiP) and system-on-module (SoM) are viable, cost-effective alternatives to transistor scaling for some applications.
Both flip-chip and wirebond interconnect technologies enable these new architectures, with cost, form factor, and system speed requirements determining design approaches. Despite significant flip-chip growth, wirebond IC packaging remains a dominant interconnect technique due to its maturity, reliability, and proven performance in specific sectors, such as automotive.
In wirebond semiconductor packaging, a die is attached to a substrate or leadframe using die attach adhesives. Wires connect die bond pads to package pads, enabling electrical connection. Die attach adhesives, including sintering materials, are a primary determinant of package and application performance and reliability, as they provide crucial mechanical bonding, thermal conductivity, and electrical conductivity in certain applications.
Wirebond semiconductor packaging is proven for high-power/high-voltage semiconductor ICs, in applications where high thermal loads and vibration stress must be managed, and when the cost of flip-chip advanced packaging is prohibitive. Despite other techniques gaining ground, wirebond remains a dominant IC interconnect approach.
High thermal materials for bare copper
Package innovators are moving to bare copper leadframes and wires for reliability at lower cost. Henkel offers die attach formulations with high thermal conductivity and bare copper compatibility.
Sintering innovation
Pressure-less and pressure-assisted sintering materials offer ultra-high thermal capability for the most demanding power devices.
Conductive die attach film pioneer
Henkel was the first to market with a conductive die attach film, addressing the needs of ultra-thin die and tight die-to-pad ratios.
Reliable wirebond packaging requires exceptional materials engineering. Deep knowledge about how wire material, pad metallization, die size, and bondline thickness affect thermal management, electrical conductivity, mechanical performance, adhesion, and reliability distinguishes die attach innovators like Henkel. Contact a Henkel expert to learn more about our die attach solutions.
- Die attach film
- Die attach paste
- Printable B-stage die attach adhesives
When miniaturization, precision, and extreme bondline control are required, die attach film is the go-to solution for die-to-substrate, die-to-leadframe, and die-to-die bonding. The dimensional precision afforded by die attach film enables thinner, higher-density, high-reliability semiconductor packages.
Die attach paste capability is a key factor in ensuring semiconductor package performance and reliability. These materials deliver mechanical strength to alleviate physical stress, while also providing crucial thermal control and, in some cases, electrical connection between the die and package.
For chip-scale package ICs that require precise bondlines, die tilt control, minimal fillets, and wirebond pads free of contamination, printable B-stage die attach adhesives offer a cost-effective alternative to traditional die attach films.
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