Semiconductors are at the heart of automotive advancements, driving the evolution of electric and autonomous vehicles. The need for higher power efficiency and thermal management in EVs and AVs has led to the adoption of wide bandgap materials like SiC and GaN, requiring novel sintering-based die-attach materials.

The future of data centers lies in advanced semiconductor designs that support the immense demands of AI and high-performance computing (HPC). As traditional methods reach their limits, cutting-edge packaging and materials are stepping in to ensure both reliability and efficiency.

5G and advanced Wi-Fi technologies are transforming connectivity, increasing the demand for more powerful and reliable semiconductors. With personal electronic devices becoming smaller and more complex, new challenges emerge in managing heat and maintaining performance.