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      Material solutions for AI data centre

      Discover Henkel Adhesive Technologies' latest solutions for AI in data centres
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      This is the cover image of material solutions for AI data center

      AI's growing demand in data centres drives the integration of high-performance chips like GPUs, FPGAs and ASICs, which generate significant heat and power densities. Advanced thermal control and interconnect protection are crucial to enhance performance and ensure longevity in these high-power systems.

      Key insights
      • The surge in AI demand in data centres necessitates advanced thermal and interconnect solutions to manage high heat and power densities for optimal performance and durability.
      • Thermal interface materials (TIMs) are essential for managing heat at the source in data centres, enhancing cooling efficiency and performance.
      • Henkel's underfills and encapsulants protect high-density AI ICs from thermo-mechanical stress, ensuring reliability in demanding conditions.

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