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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Part no. (SKU/IDH):
1467941

IDH Name:
LOCTITE ABLESTIK 84-1LMISR4

Die attach adhesives

LOCTITE® ABLESTIK 84-1LMISR4

Rigid, electrically conductive die-attach adhesive for small components

A 1-part, epoxy-based electrically conductive die-attach adhesive perfect for small component assembly.

Part no. (SKU/IDH):
1467941

IDH Name:
LOCTITE ABLESTIK 84-1LMISR4

Part no. (SKU/IDH): 1467941
LOCTITE ABLESTIK 84-1LMISR4

Size Please make your selection 3.6 g

Packaging type Please make your selection Barrel

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ABLESTIK 84-1LMISR4 is a silver, electrically conductive die-attach adhesive for high-throughput, automated equipment. Its rigid nature allows minimum adhesive dispense and die put-down dwell time without tailing or stringing problems. It’s formulated with an epoxy-based resin and cures when exposed to heat. This is one of the most widely used die-attach adhesives in the semiconductor industry—and for good reason.

  • Product category:
  • Electrically conductive adhesives

Technologies:

  • Application method:
  • Dispense system

 

  • Applications:
  • Die attach

 

  • Coefficient of thermal expansion (CTE):
  • 40.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 150.0 ppm/°C

 

  • Color:
  • Silver

 

  • Cure schedule, @ 175.0 °C:
  • 1.0 h

 

  • Cure type:
  • Heat cure

 

  • Extractable ionic content, Chloride (CI-):
  • 20.0 ppm

 

  • Extractable ionic content, Potassium (K+):
  • 10.0 ppm

 

  • Extractable ionic content, Sodium (Na+):
  • 10.0 ppm

 

  • Glass transition temperature (Tg):
  • 120.0 °C

 

  • Moisture absorption, 168 hr. @ 85°C/85% RH:
  • 0.6 %

 

  • Number of components:
  • 1 part

 

  • Physical form:
  • Paste

 

  • Recommended for use with:
  • LeadFrame: gold; LeadFrame: silver

 

  • Tensile modulus, @ 250.0 °C:
  • 300.0 N/mm² (44000.0 psi)

 

  • Thermal conductivity:
  • 2.5 W/mK

 

  • Thixotropic index:
  • 5.6

 

  • Viscosity, Brookfield CP51, @ 25.0 °C:
  • 8000.0 mPa·s (cP)

 

  • Volume resistivity:
  • ≤ 0.0002 Ohm cm

 

     

       

         

           

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