Die attach adhesives
Rigid, electrically conductive die-attach adhesive for small components
A 1-part, epoxy-based electrically conductive die-attach adhesive perfect for small component assembly.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK 84-1LMISR4 is a silver, electrically conductive die-attach adhesive for high-throughput, automated equipment. Its rigid nature allows minimum adhesive dispense and die put-down dwell time without tailing or stringing problems. It’s formulated with an epoxy-based resin and cures when exposed to heat. This is one of the most widely used die-attach adhesives in the semiconductor industry—and for good reason.
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Offers excellent dispensability
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Box oven cure
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Requires minimum dispense
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Offers a long work life
- Product category:
- Electrically conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Application method:
- Dispense system
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 40.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 150.0 ppm/°C
- Color:
- Silver
- Cure schedule, @ 175.0 °C:
- 1.0 hr.
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 20.0 ppm
- Extractable ionic content, Potassium (K+):
- 10.0 ppm
- Extractable ionic content, Sodium (Na+):
- 10.0 ppm
- Glass transition temperature (Tg):
- 120.0 °C
- Moisture absorption, 168 hr. @ 85°C/85% RH:
- 0.6 %
- Number of components:
- 1 part
- Physical form:
- Paste
- Recommended for use with:
- LeadFrame: gold; LeadFrame: silver
- Tensile modulus, @ 250.0 °C:
- 300.0 N/mm² (44000.0 psi)
- Thermal conductivity:
- 2.5 W/mK
- Thixotropic index:
- 5.6
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 8000.0 mPa·s (cP)
- Volume resistivity:
- ≤ 0.0002 Ohm cm
