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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Protecting technologies for electronics - Underfill, Glob Top and Dam&Fill

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Enhancing electronics reliability

Protection materials are some of the most vital elements of next-generation electronic system design. Safeguarding function and extending the useful life of electronic systems are vital to protecting investment. Recognizing this need, we are organizing a 90-minute webinar focused on protecting technologies for electronics, with emphasis on underfill, glob top and dam and fill solutions.

Key insights

Featured speakers

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Kris Machiels
Principal Application Engineer

Tom Pilgram
Technician Application Engineering

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