Automotive electronics are at the heart of safer, more connected, and more intelligent vehicles, driving the performance of ADAS, electrification, and advanced E/E architectures. Henkel supports this rapidly evolving market with reliable and sustainable solutions for thermal management, bonding, and protection helping customers design robust electronics while enabling efficient, high-speed production.
Henkel solutions enable reliable bonding, thermal management, and protection of sensors, cameras, and control units critical for ADAS performance. They help preserve signal accuracy and functional safety under heat, vibration, and harsh automotive environments.
As vehicles move toward centralized and zonal E/E architectures, Henkel supports robust electronics design through advanced thermal, insulation, and protection materials. Our solutions ensure stable electrical performance, efficient heat control, and scalable production across vehicle platforms.
- ADAS Camera
- ADAS Radar
- ADAS Lidar
- ADAS Domain Controller
- ADAS V2X
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Threadlockers lock and seal your threaded assemblies, protecting against vibration, corrosion and galling. But depending on your needs, you'll have to choose the right threadlocker and consider strength, form and removability. Which one will you need? LOCTITE® makes your choice easy.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today's challenging, high-density die architectures.
Achieve optical active alignment with advanced dual-cure or 1-step-cure adhesives designed for reliable functionality in ADAS camera and lidar modules.
At every level of camera construction — from the active alignment adhesives, image processor die-attach to component connection, thermal management, underfill materials and structural bonding of the final module assembly — Henkel's automotive camera solutions offer a comprehensive choice, enabling superior functionality and reliability.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Improve reliability with lead-free solder alternatives ideal for SMT components, thermal, structural bonding and EMI applications.
Thermal interface materials, gaskets and coatings with an electromagnetic absorption or shielding feature.
Ensuring radar systems continue to function correctly depends largely on the integrity of the components in the units themselves and how they are mounted to the vehicle. Additionally, as these particular components continue to become smaller, efficient heat dissipation and thermal protection is crucial to long-term functionality. Those functions will be strengthened through Liquid Gasket Solutions, underfill and Thermal Interface Materials.
Achieve optical active alignment with advanced dual-cure or 1-step-cure adhesives designed for reliable functionality in ADAS camera and lidar modules.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today's challenging, high-density die architectures.
Provide tough, durable bonds on a wide variety of surfaces in engineering applications.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
LiDAR (Light Imaging, Detection and Ranging) systems provide a very fast and high-definition topography of the environment using laser with an additional advantage — the calculation of distances between vehicles and other objects' sensors. For this specific technology, Henkel provides the material solutions to assemble these sensors, including lens bonding materials, die attach, underfill and thermal interface materials.
Threadlockers lock and seal your threaded assemblies, protecting against vibration, corrosion and galling. But depending on your needs, you'll have to choose the right threadlocker and consider strength, form and removability. Which one will you need? LOCTITE® makes your choice easy.
Thermal interface materials, gaskets and coatings with an electromagnetic absorption or shielding feature.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals and extreme temperature variations.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today's challenging, high-density die architectures.
At the core of modern ADAS, domain controllers consolidate and process data from multiple sensors—including cameras, radar, lidar, and ultrasonic systems—to enable real-time decision-making and functional safety. Henkel provides solutions for these systems, including advanced thermal management, structural bonding, EMI shielding, and component and package-level protection, helping ensure robust performance, long-term reliability, and scalable production for semi- and fully autonomous vehicles.
Level 5 autonomous driving is the next frontier in ADAS advancement and V2X systems are the essential connectivity function that makes this possible.
V2X encompasses both V2V and V2I connectivity, two technologies that are crucial to the rise of Level 5 autonomous driving.
Henkel materials are integral to these devices, especially thermal interface materials, underfills and encapsulants.
- Zone controller
- Cockpit domain control unit
- Vehicle computing unit
- Electronic control unit
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Zone controllers aggregate data from sensors and actuators within a defined vehicle area, reducing wiring complexity and enabling faster, more reliable communication. Henkel provides solutions for zone controllers, including thermal management, electrical protection, EMI shielding, and sealing, ensuring consistent performance and robust operation in demanding automotive environments.
Protect PCBs against harsh environmental conditions and chemicals while conserving weight and space.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Improve reliability with lead-free solder alternatives ideal for SMT components, thermal, structural bonding and EMI applications.
Thermal interface materials, gaskets and coatings with an electromagnetic absorption or shielding feature.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals and extreme temperature variations.
Cockpit domain control units combine infotainment, displays, connectivity, and HMI functions, handling high data rates and increasing thermal loads. Henkel provides advanced materials for heat dissipation, bonding, and component protection, helping ensure reliable performance, premium user experience, and long-lasting durability.
Protect PCBs against harsh environmental conditions and chemicals while conserving weight and space.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Thermal interface materials, gaskets and coatings with an electromagnetic absorption or shielding feature.
Thermal interface materials, gaskets and coatings with an electromagnetic absorption or shielding feature.
Vehicle computing units handle vehicle‑wide data processing, consolidating workloads for ADAS, vehicle control, and connectivity in centralized architectures. Henkel provides solutions for these systems, including advanced thermal management, structural bonding, EMI shielding, and component protection, helping ensure stable performance, system robustness, and long-term reliability under high compute and power loads.
Protect PCBs against harsh environmental conditions and chemicals while conserving weight and space.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid- and gas-tight seams, joints and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Improve reliability with lead-free solder alternatives ideal for SMT components, thermal, structural bonding and EMI applications.
Thermal interface materials, gaskets and coatings with an electromagnetic absorption or shielding feature.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals and extreme temperature variations.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today's challenging, high-density die architectures.
Modern vehicles rely on electronic control units, the heart of the vehicle. Control units must meet high automotive standards and are enabled by thermal materials, conductive pastes, film adhesives, encapsulants, coatings, sealants and potting.
- Parking sensor
- Door handle
- Servo motor
- Wire harness
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals and extreme temperature variations.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals and extreme temperature variations.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals and extreme temperature variations.
Typically, ultrasonic (parking) sensors are placed on the front and rear bumpers. Reliability and functionality depend on effective component integration and vehicle mounting, as well as thermal protection, potting and encapsulation.
Designed to simplify the assembly processes for faster and more efficient protection of sensors, connectors, cables and wire harness assemblies.
Door handle sensors in automotive electronics incorporate smart technology for keyless entry and enhanced security. Henkel adhesives optimise the performance of these sensors, ensuring a robust and enduring bond between the handles and electronic components. Crafted with precision, these adhesives contribute to a reliable and efficient automotive experience.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals and extreme temperature variations.
Servo motors are pivotal in automotive electronics, providing precise control over essential functions like throttle, braking and power steering, thereby enhancing overall vehicle performance and safety. The adhesive solutions further reinforce the reliability of servo motors by encapsulating and protecting sensitive electronic components, ensuring resilience against environmental factors and contributing to the longevity and durability of these critical systems.
Our potting systems and the fully automated application process for potting electronic housings and connector pins are perfectly matched with one another and adapted to your specific component requirements.
Our polyurethane potting for moulding is characterised by excellent thermal insulation as well as high dielectric strength and heat resistance. There is also an optimal stiffness-to-weight ratio. In addition, the moulded parts are characterised by their excellent elasticity and abrasion resistance, even under continuous stress.
A wire harness routes wires and electricity for vehicle operation, and must protect the wires from vibration, moisture and abrasion while organising the system for safe, optimised vehicle performance. Advanced materials provide reliable and highly efficient bonding, such as potting and low-pressure moulding solutions.
- Centre Information Display and Cluster Panel
- Head Up Display
- Digital Mirror
Liquid optically clear adhesives (LOCA) are designed for optimised lamination processes in optical bonding, enabling optical components for improved contrast ratio, impact-, heat- and moisture resistance.
Henkel can provide tough, durable bonds on a wide variety of surfaces in Automotive display applications, and offers solutions for bonding of narrow borders in thin bond lines where quick handling strength is required.
Henkel provides a broad range of coating systems that enhance and protect product surfaces. Their properties span the range of surface energies, from hydrophobic to hydrophilic, oleophobic to oleophilic, and they provide protection against microbial growth, fingerprints, stains and abrasion.
Next-generation cockpit displays are designed in rich, curved and large sizes and offer many types of important information in high resolution.
Henkel offers solutions such as optical bonding, structural bonding and thermal interface materials.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Achieve optical active alignment with advanced dual-cure/1-step adhesives designed for reliable functionality.
Liquid optically clear adhesives (LOCA) are designed for optimised lamination processes in optical bonding, enabling optical components for improved contrast ratio, impact-, heat- and moisture resistance.
Henkel can provide tough, durable bonds on a wide variety of surfaces in Automotive display applications and give solutions for bonding of narrow borders in thin bond lines where quick handling strength is required.
The HUD shows various information to the driver on the windscreen, meaning the driver does not need to look down to the instrument cluster or navigation screen. The latest HUD is fully connected with ADAS systems.
Henkel offers solutions such as optical bonding, structural bonding, active alignment adhesives and thermal interface materials.
Henkel can provide tough, durable bonds on a wide variety of surfaces in Automotive display applications and give solutions for bonding of narrow borders in thin bond lines where quick handling strength is required.
Liquid optically clear adhesives (LOCA) are designed for optimised lamination processes in optical bonding, enabling optical components for improved contrast ratio, impact-, heat- and moisture resistance.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
To optimise the field of view and increase safety, Henkel offers solutions such as optical bonding and structural bonding for the next-generation mirrors.
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