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Across the wireless network and within edge devices, advanced semiconductor technology forms the foundation of the high-speed connections users expect. From complex, highly integrated wireless RF front-end modules to multi-die and SiP packages and faster, smarter processors, semiconductor ICs and the materials that support them enable reliable, responsive, resilient wireless connectivity.
By 2035
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The smartphone application processor market is set to grow at a solid compound annual growth rate of ~6.2% over the next 10 years.1
SoC Growth
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Demand for connectivity and the expansion of mobile devices are driving explosive growth in SoCs.2
6G
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The move to build on 5G’s fixed wireless access and faster download speeds is underway. If successful, projections indicate that 6G will grow at a CAGR of 46% from 2030 to 2036.3
ICs built on advanced silicon node flip chips are essential to mobile device performance. And chip reliability is largely determined by the materials that protect them against mechanical and thermal stress. Henkel has the solution.
- Application processors
- Wireless SoC
- Wireless RF front-end
As fan-out wafer-level packaging gains steam, L-MUF delivers time-saving, protective encapsulation of the package and interconnects with a single material.
Efficient and thorough heat dissipation becomes even more challenging with smaller form factors, making high thermal adhesives a necessity.
Fast flow, low stress, high reliability, high thermal underfills protect delicate interconnects from thermal and mechanical stress.
Application processor performance is critically dependent on cutting-edge packaging materials that support billions of transistors at smaller nodes on bigger dies, complex co-packaged architectures, and built-in, cutting-edge AI capabilities. Underfills, molding encapsulants, and high thermal adhesives ensure processors thrive under demanding telecom operational conditions.
Conductive die attach film with higher thermal conductivity enables the thinner, smaller form factors and meets the increasingly demanding thermal control requirements of next-gen packages.
Unique film technology enables the stealth dicing to support processing of thin, high-density dies.
Wireless SoCs and the chipsets powering routers, access points (APs), fixed wireless access (FWA), and customer premises equipment (CPE) are meeting the need for more power-hungry capabilities in increasingly smaller form factors. These converging forces demand materials like die attach film that deliver thin, consistent bond line thicknesses with tight keep out zones across large surface areas.
Efficient and thorough heat dissipation becomes even more challenging with smaller form factors, making high thermal die attach pastes a necessity.
Conductive die attach film with higher thermal conductivity enables the thinner, smaller form factors and meets the increasingly demanding thermal control requirements of next-gen packages.
High-power RF transmission infrastructure is moving toward wide band gap GaN and SiC devices to cope with power and efficiency requirements. Sintering is quickly becoming the preferred die-to-substrate bonding solution, providing a strong, low-resistance connection with high thermal conductivity and evenly distributing stress during thermal cycling.
Both telecom infrastructure and edge devices depend on RF front-end performance. As consumer device designs move toward higher integration within thinner, smaller form factors for more RF band support, and higher power RF transmission pushes out silicon in favor of Gallium Nitride for baseband power efficiency, high-performance electronic materials like high thermal die attach paste, conductive die attach film, and high thermal sintering solutions become even more critical enablers of reliable functionality and signal integrity.