Case study
Learn how the manufacturer of an autonomous guided vehicle dissipated heat for optimised function with Henkel thermal management materials.
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A new electronic control unit (ECU) design incorporates a large processor IC that requires excellent heat dissipation for optimised function. The system is sensitive and outgassing minimisation is necessary to avoid interference with other components.
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Exceptional high compliance and softness for very low assembly stress -
Thorough gap filling for optimised thermal transfer with a thermal conductivity of 3.0 W/m-K -
Easy handling for production efficiency -
Low outgassing formulation reduces concerns of contamination exposure -
Sensitive components protected from residue interference
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